Amphenol ICC (FCI) DILB32P-223TLF
- DILB32P-223TLF
- Amphenol ICC (FCI)
- CONN IC DIP SOCKET
- Sockets for ICs, Transistors
- DILB32P-223TLF Ficha técnica
- -
- -
- Lead free / RoHS Compliant
- 2585
- Inventário spot/distribuidores autorizados/inventário excedentário de fábrica
- 1 ano de garantia de qualidade 》
- Clique para obter taxas
Part Number DILB32P-223TLF |
Category Sockets for ICs, Transistors |
Manufacturer Amphenol ICC (FCI) |
Description CONN IC DIP SOCKET |
Package - |
Series * |
Type DIP, 0.6" (15.24mm) Row Spacing |
Features Open Frame |
Operating Temperature -55°C ~ 125°C |
Mounting Type Through Hole |
Termination Solder |
Housing Material Polyamide (PA), Nylon |
Pitch - Mating 0.100" (2.54mm) |
Contact Finish - Mating Tin-Lead |
Contact Finish - Post Tin-Lead |
Contact Finish Thickness - Mating 100µin (2.54µm) |
Number of Positions or Pins (Grid) 32 (2 x 16) |
Contact Material - Mating Copper Alloy |
Pitch - Post 0.100" (2.54mm) |
Contact Finish Thickness - Post 100µin (2.54µm) |
Contact Material - Post Copper Alloy |
Package_case - |
DILB32P-223TLF Garantias
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• Qualidade garantida
• Acesso Global
• Preço de mercado competitivo
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Comentários
Amphenol ICC (FCI)
Amphenol Information Communication & Commercial - Amphenol ICC, a division of Amphenol, was established through the alignment of Amphenol FCI (AFCI) and Amphenol IT Communications Products (AITC) from January 2017. The new Amphenol ICC division ...
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